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B3 Version Chipset
- Supports the Intel 2nd generation Core i7 and Core i5 processors in the 1155 package
- Intel H67 single chip architecture
- 7 Phases Power Design
- Support 4-DIMM DDR3-1333/1066 up to 32G maximum capacity
- Support SATA 6Gb/s 2X speed than current SATA 3G
- Support USB 3.0
- THX(TruStudio Pro) Technology for true studio audio experience
- Support Display Port for high definition viewing.
- 100% X.D.C solid capacitor
- BIOSTAR G.P.U (Green Power Utility) Technology for Energy Saving
- BIOSTAR Toverclocker utility
Motherboards
Memorys
Industrial Motherboards