- Support the Intel 3rd and 2nd generation Core i7 and Core i5 processors in the 1155 package
- Intel H77 single chip architecture
- Support 4-DIMM DDR3-2400(OC)/ 2200(OC)/ 2000(OC)/ 1800(OC)/ 1600/ 1333 up to 32G maximum capacity
- Support SATA 6Gb/s 2X speed than current SATA 3G
- Support USB 3.0
- 100% X.D.C solid capacitor
- BIOSTAR G.P.U (Green Power Utility) Technology for Energy Saving
- BIOSTAR Toverclocker utility
Motherboards
Memorys
Industrial Motherboards